copper interconnect meaning in Chinese
铜线互连，铜互连线
Examples
- State - of - the - art of the on - chip copper interconnect technology for ulsi ' s
集成电路片内铜互连技术的发展 - The power3 - ii reimplemented power3 using copper interconnects , delivering double the performance at about the same price
Power3 - ii使用铜作为连接介质重新实现了power3 ，这样以相同的价格可以获得两倍的性能。 - Studies on the stress of copper interconnects include the stress measurement by xrd , computer simulation and observation the local stress distribution with snam
利用薄膜应力测试分布仪和xrd测量硅基铜膜及铜互连线薄膜宏观应力。 - Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem , the measurement of texture by xrd and ebsd , the evaluation of barriers by xps and aes
铜互连线的微观结构的研究：通过afm 、 sem 、 tem等的分析方法对铜膜及铜互连线薄膜的晶粒尺寸进行了评价。 - In this thesis , focusing on the copper diffusion failure of copper interconnects in the ulsi , such as electromigration , stressmigration and copper diffusing into silicon dioxide and silicon , the microstructure and the stress of copper interconnects in ulsi have been studied systemically
本论文从ulsi铜互连技术可靠性研究中的铜扩散失效问题出发，针对电徙动失效、应力迁移失效、层间扩散失效问题，对铜互连线的微观结构和应力进行了研究。